Solder Materials - Wspc Series in Advanced Integration and Packaging - Lin, Kwang-Lung (National Cheng Kung University, Taiwan) - Books - World Scientific Publishing Co Pte Ltd - 9789813237605 - September 5, 2018
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Lin, Kwang-Lung (National Cheng Kung University, Taiwan)
Solder Materials - Wspc Series in Advanced Integration and Packaging

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388 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released September 5, 2018
ISBN13 9789813237605
Publishers World Scientific Publishing Co Pte Ltd
Pages 388
Dimensions 150 × 220 × 20 mm   ·   684 g

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