Chiplet Design and Heterogeneous Integration Packaging - John H. Lau - Books - Springer Verlag, Singapore - 9789811999161 - March 28, 2023
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Chiplet Design and Heterogeneous Integration Packaging 2023 edition


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525 pages, 501 Illustrations, color; 42 Illustrations, black and white; XXII, 525 p. 543 illus., 501

Media Books     Hardcover Book   (Book with hard spine and cover)
Released March 28, 2023
ISBN13 9789811999161
Publishers Springer Verlag, Singapore
Pages 525
Dimensions 242 × 162 × 33 mm   ·   1.07 kg

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