3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics - - Books - Springer International Publishing AG - 9783319830865 - July 13, 2018
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3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics Softcover reprint of the original 1st ed. 2017 edition

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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.

463 pages, 253 Illustrations, color; 78 Illustrations, black and white; IX, 463 p. 331 illus., 253 i

Media Books     Paperback Book   (Book with soft cover and glued back)
Released July 13, 2018
ISBN13 9783319830865
Publishers Springer International Publishing AG
Pages 463
Dimensions 150 × 220 × 10 mm   ·   662 g
Language German  
Editor Goyal, Deepak
Editor Li, Yan

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