Interconnect Reliability in Advanced Memory Device Packaging - Springer Series in Reliability Engineering - Gan, Chong Leong, - Books - Springer International Publishing AG - 9783031267079 - April 29, 2023
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Gan, Chong Leong,
Interconnect Reliability in Advanced Memory Device Packaging - Springer Series in Reliability Engineering 2023 edition

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This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.

210 pages, 50 Tables, color; 89 Illustrations, color; 11 Illustrations, black and white; XVIII, 210

Media Books     Hardcover Book   (Book with hard spine and cover)
Released April 29, 2023
ISBN13 9783031267079
Publishers Springer International Publishing AG
Pages 210
Dimensions 150 × 220 × 20 mm   ·   553 g
Language German  

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