Advanced Thermal Stress Analysis of Smart Materials and Structures - Structural Integrity - Zengtao Chen - Books - Springer Nature Switzerland AG - 9783030252038 - September 19, 2020
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Advanced Thermal Stress Analysis of Smart Materials and Structures - Structural Integrity 2020 edition

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This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.


304 pages, 10 Tables, color; 44 Illustrations, color; 60 Illustrations, black and white; X, 304 p. 1

Media Books     Paperback Book   (Book with soft cover and glued back)
Released September 19, 2020
ISBN13 9783030252038
Publishers Springer Nature Switzerland AG
Pages 304
Dimensions 150 × 220 × 10 mm   ·   444 g
Language German  

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