SiC Power Module Design: Performance, robustness and reliability - Energy Engineering - Alberto Castellazzi - Books - Institution of Engineering and Technolog - 9781785619076 - February 3, 2022
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Alberto Castellazzi
SiC Power Module Design: Performance, robustness and reliability - Energy Engineering

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Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.

360 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released February 3, 2022
ISBN13 9781785619076
Publishers Institution of Engineering and Technolog
Pages 360
Dimensions 241 × 163 × 28 mm   ·   725 g
Language English  
Editor Castellazzi, Alberto (Professor, Kyoto University of Advanced Science, Japan)
Editor Irace, Andrea (Professor of Electronics, University of Naples Federico II, Italy)

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