Packaging of High Power Semiconductor Lasers - Micro- and Opto-Electronic Materials, Structures, and Systems - Xingsheng Liu - Books - Springer-Verlag New York Inc. - 9781493955909 - October 1, 2016
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Xingsheng Liu
Packaging of High Power Semiconductor Lasers - Micro- and Opto-Electronic Materials, Structures, and Systems Softcover reprint of the original 1st ed. 2015 edition

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This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

417 pages, 111 black & white illustrations, 386 colour illustrations, 27 black & white tables, biogr

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 1, 2016
ISBN13 9781493955909
Publishers Springer-Verlag New York Inc.
Pages 402
Dimensions 150 × 220 × 10 mm   ·   710 g
Language English  

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