SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide - Li (Li Yang), Suny - Books - John Wiley & Sons Inc - 9781119045939 - July 24, 2017
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Li (Li Yang), Suny
SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide

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An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow.

496 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released July 24, 2017
ISBN13 9781119045939
Publishers John Wiley & Sons Inc
Pages 400
Dimensions 252 × 177 × 30 mm   ·   907 g
Language English  

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