Microelectronics Packaging Handbook: Subsystem Packaging Part III - R.R. Tummala - Books - Chapman and Hall - 9780412084515 - January 31, 1997
In case cover and title do not match, the title is correct

Microelectronics Packaging Handbook: Subsystem Packaging Part III 2nd ed. 1997 edition

Price
NZ$ 324
excl. VAT

Ordered from remote warehouse

Expected delivery Jul 22 - Aug 7
Get notified about new R.R. Tummala releases
Add to your iMusic wish list

Not rated yet

Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages.


657 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 31, 1997
ISBN13 9780412084515
Publishers Chapman and Hall
Pages 628
Dimensions 155 × 235 × 36 mm   ·   993 g
Language English   French  

More by R.R. Tummala

Show all

More from the same publisher