Fundamentals of Microsystems Packaging - Rao Tummala - Books - McGraw-Hill Education - Europe - 9780071371698 - May 29, 2001
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Rao Tummala
Fundamentals of Microsystems Packaging Ed edition

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Suitable for engineers, technicians, and students, this book teaches microsystems packaging. It covers the field from wafer to systems, including various major contributing technologies. It features a comprehensive tutorial covering various major aspects of microelectronics, photonics, RF, packaging design, assembly, reliability, and, testing.

967 pages, 150 Illustrations, unspecified

Media Books     Hardcover Book   (Book with hard spine and cover)
Released May 29, 2001
ISBN13 9780071371698
Publishers McGraw-Hill Education - Europe
Pages 967
Dimensions 234 × 338 × 64 mm   ·   1.87 kg
Language English  

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