Design And Modeling For 3d Ics And Interposers - Wspc Series In Advanced Integration And Packaging - Swaminathan, Madhavan (Georgia Inst Of Technology, Usa) - Books - World Scientific Publishing Co Pte Ltd - 9789814508599 - December 24, 2013
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Swaminathan, Madhavan (Georgia Inst Of Technology, Usa)
Design And Modeling For 3d Ics And Interposers - Wspc Series In Advanced Integration And Packaging

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380 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 24, 2013
ISBN13 9789814508599
Publishers World Scientific Publishing Co Pte Ltd
Pages 380
Dimensions 236 × 156 × 26 mm   ·   672 g

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