Advanced Flip Chip Packaging - - Books - Springer-Verlag New York Inc. - 9781489979339 - August 23, 2016
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Advanced Flip Chip Packaging Softcover reprint of the original 1st ed. 2013 edition

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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.

560 pages, 37 Tables, black and white; VII, 560 p.

Media Books     Book
Released August 23, 2016
ISBN13 9781489979339
Publishers Springer-Verlag New York Inc.
Pages 560
Dimensions 234 × 157 × 32 mm   ·   953 g
Language English  
Editor Lai, Yi-Shao
Editor Tong, Ho-Ming
Editor Wong, C.P.